Celeno launches 3x3 450Mbps video-grade Wi-Fi/USB chip

IBC 2011, AMSTERDAM, THE NETHERLANDS: Celeno Communications, a leading provider of semiconductors for multimedia Wi-Fi home networking applications, announced the CLR250 3x3 450Mbps Wi-Fi/USB chip.

The CLR250 provides service providers and OEMs with a video-grade Wi-Fi solution and cost-effective USB-based architecture to help monetize and accelerate the adoption of IP-based video services. Powered by Celeno’s signature video-grade OptimizAIR technology, the new solution is now available to enhance set-top boxes (STBs) and media players with wireless connectivity, delivering superior performance and quality of service (QoS) at a low cost.

“Service providers are increasingly looking to offer robust wireless home networking infrastructure to enable IP-based video services in the home across different platforms, simply and flexibly,” according to Michael J. Palma, IDC’s research manager for consumer device semiconductors. “The challenge has been to maintain a high quality wireless video experience at a reasonable price.”

“The CLR250 specifically addresses this challenge,” explained Lior Weiss, VP of Marketing at Celeno. “The chip is the first Wi-Fi/USB 3x3 with digital beam forming solution in the market that meets the rigorous requirements of whole-home wireless video distribution and helps OEMs reduce the price curve with a cost effective USB architecture.”

STB, DVR, TV and media player manufacturers can embed the new Celeno chip in their solutions, integrating it with the main media processor SoC through a common USB interface. The device can also be used to power video-grade after-market Wi-Fi/USB adaptors that service providers can deploy by simply plugging a Wi-Fi/USB adaptor into an external USB connector on a STB or other display device. The adaptor transforms the STB or TV into a video-grade Wi-Fi connected device to ensure plug-and-play, self-install simplicity.

Related articles

US semiconductor industry likely to increase to $66.1 billion by end 2015
Dialog power management and Audio ICs adopted by Samsung for Android smartphones
Motion sensing on smaller and sleeker gadgets to result from ST's innovation
Altera announces industry's first OpenCL program for FPGAs
NI extends leading PXI RF test performance to 14 GHz